Felder Sn96,5Ag3,0Cu0,5, DIN EN 9453
Flux DIN EN ISO 9454-1: 2016, 1232 (REL1)
Metal content 88,5%, grain size type 4
100g jar
The FELDER ISO-Cream® "Active-Clear" differs from the basic version ISO-Cream® "Clear" in the degree of activation. The ISO-Cream® "Active-Clear" has a REL1 flux classification and therefore has a low halogen content (<0.15 %) but is still a genuine NoClean paste. In addition to the properties of the basic version ISO-Cream "Clear", special attention was paid in this further development to an optimized spread, especially on "problematic" surfaces such as chem. Gold (ENIG) or chem. Silver.
ISO-Cream®"Active-Clear" offers the user the possibility to also work with a moderate print image or with more oxidized surfaces of PCB and components and still achieve excellent soldering results. The soldering paste is also low in odor and forms almost colorless flux residues, which spread only to a very limited extent. This is particularly interesting for users who have integrated an automatic optical inspection (AOI) into their process.
In addition, ISO-Cream® "Active-Clear" is also free of any thixotropic agents that could reduce viscosity with increasing shear forces. This guarantees a constant viscosity over a long period of use. In laboratory tests the solder paste showed no bridging, no tendency to tombstoning or solder bead formation on bipolar components.
| Composition | 96.5% tin, 3% silver, 0.5% copper (SAC305) |
| Grain size | Type 4 Recommended min. edge length of the stencil aperture 200µm Recommended stencil thickness 100-150µm |
| Package size | 100g |
| Lead-free | Yes, RoHS compliant |
| No-Clean | Yes |
| Halogen content | very low, REL1 < 0,15% |
| EN ISO 9454 | 1.2.3.2 |
| Metal content | 88,5% |
| Shelf life | 12 months at room temperatur (up to 20°C) |
| Transport | We ship with cooling pack in hot summer and with insulation fleece in freezing winter. In the critical seasons, UPS Express Saver shipping is highly recommended. |
Des structures de plus en plus fines et des composants de plus en plus petits posent de grandes exigences à l'impression de la pâte à braser. Après une étude de marché intensive, Multi-CB propose les imprimantes à pochoirs SMD suivantes de haute précision pour les prototypes ainsi que pour les petites et moyennes séries.
Tous les appareils impriment de manière précise et reproductible, même les structures les plus fines. Nous mettons l'accent sur des normes de qualité élevées et un rapport coût/avantage optimal.
| khs-instruments SMT-PCB-A4 | PAGGEN TSD240 | FRITSCH printALL005 | |
|---|---|---|---|
| Pochoir SMD simple face | |||
| Pochoir SMD double face | |||
| hauteur maximale du composant | 8 mm | 11 mm | 18 mm |
| Taille PCB max.* | 105mm x 180mm | 180mm x 240mm | 270mm x 330mm |
| Taille Pochoir SMD max. | 200mm x 200mm | 175mm x 255mm | 280mm x 360mm |
| Structure la plus petite | 0,5 mm | 0,5 mm | 0,5 mm |
| Levée parallèle (séparation verticale) | |||
| Unrolling the stencil | |||
| Hauteur Z réglable | 1mm or 1,6mm | ||
| Alignement de l'axe-X | Manually | ||
| Alignement de l'axe-Y | Manually | ||
| Alignement de l'axe-thêta | Manually | ||
| Surface du stand | 170mm x 280mm | 240mm x 370mm | 360mm x 545mm |
| Poids | 1,6 kg | 7 kg | 15 kg + 2 kg (cadre de serrage ) |
| Prix | 230,00 € | 1093,00 € | 1998,00 € |
The PAGGEN TSD240 stencil printer is suitable for high-precision manual application of solder paste or adhesive on printed circuit boards. The outstanding design for this price range makes manual assembly much easier.
| SMD-Stencil size max. | 175mm x 255mm |
| SMD-Stencil size min. | ca. 40mm x 40mm |
| PCB size max.* | 175mm x 255mm |
| Height setting | 25mm |
| Dimensions (WxLxH) | 285mm x 455mm x 115mm |
| Stand area | 360mm x 545mm |
| Weight | 8,8kg | |
*The max. printing area is peripherically approx. 10mm smaller.
The FRITSCH printALL005 is a manual stencil printing system with a sturdy base frame for a very high print quality, suitable for applying solder paste or adhesive to printed circuit boards. The solid construction offers a clean and reproducible print with easy handling, even for small components with fine structures up to 0.5 mm.
The X-Y and Theta-axis can be set quickly and easily by using knurled screws. A parallel lift ensures a clean separation of PCB and SMD-Stencil, which guarantees an improved release of the solder paste. It is ideally suited for the production of prototypes and small series.
Already included is the universal clamping frame (903.204), which fits a wide variety of stencil dimensions. The clamping is done from two sides, there are no stencil mounting holes necessary.
Plus 23,90 net packaging costs for the safe shipping of 17 kg high-tech equipment
| SMD-Stencil size max. | 280mm x 360mm |
| SMD-Stencil size min. | ca. 50mm x 50mm |
| PCB size max.* | 270mm x 330mm |
| Adjusting range X/Y | ± 7.5mm |
| Adjusting range Theta | ± 3° |
| Dimensions (WxLxH) | 400mm x 650mm x 150mm, closed |
| Stand area | 360mm x 545mm |
| Weight | 15kg + 2 kg (clamping frame) |
*The max. printing area is peripherically approx. 10mm smaller.
