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SMD-Stencil
Flex
Rigid-Flex
Metal core
SMD-Stencil Printer
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Flex
Name
Your article no.
Layers
1 Layer
Uneven layer count possible
1 Layer
2 Layers
3 Layers
4 Layers
5 Layers
6 Layers
please choose
Top
Bot
Info
Workdays
For a selection, please first „Calculate“
Estimated dispatch
Format
Single pieces
Single pieces
Panel
Info
Panel Type
Multiplier
Multiplier
Mixed multiplier
Info
Panelization
No, panelized data provided
Yes, by Multi-CB
No, panelized data provided
Panel Creation
No
Yes, panel configurator – without approval of data
Your advantage: No approval of panel necessary, immediate production start
Yes, attach panel drawing
Approval of panel creation necessary
No
Please submit your production data as completed panel
Info
Size (x/y)
X
mm
Quantity
Pieces
Info
Mechanical treatment
Milled with bridges
Milled with bridges
without mech. treatment
Panel Preview
Milled with perf. bridges
Milled with bridges
Milled without bridges
Scored
Panel size (x/y)
X
mm
Size (Piece)
X
mm
PCBs / x-, y-Axis
X
Pieces
Quantity (Pieces per panel)
Pieces
Info
Border
Without
Above/Below
Left/Right
Surrounding
mm
Info
Mechanics (x) / Spacing
Milled with bridges
Milled with bridges
Milled and Scored
Without
mm
Info
Mechanics (y) / Spacing
Please Choose
Milled with bridges
Milled and Scored
Without
mm
Info
Data for soldering paste
Yes
Info
No X-Out
No
Standard
No
non-standard
Forbid X-Outs in panel
Info
Different layouts per panel
Pieces
Info
PCBs per panel
Pieces
Quantity
Panel
Pieces
Surface finish
Chemical gold (ENIG)
Standard
Chemical gold (ENIG)
non-standard
Bonding gold (ENEPIG)
Chemical silver
Copper blank
Without copper
Min. track / space,
annular ring
≥ 100µm
≥ 150µm
≥ 125µm
≥ 100µm
Info
Min. drills
≥ 0.2mm
≥ 0.3mm
≥ 0.2mm
non-standard
≥ 0.15mm
Polyimide base material
Flexibel
Flexibel
Flexibel adhesiveless
Flexibel DuPont
25µm
Standard
25µm
50µm
non-standard
75µm
100µm
125µm
150µm
Stiffener
without
without
Top
Bot
both sides
Final Thickness
0.3mm
0.2mm
0.3mm
0.5mm
0.8mm
1.0mm
Info
Cu outer layers (final)
35µm
18µm
35µm
70µm
Info
Cu inner layers (final)
35µm
18µm
35µm
70µm
Cover
PI Coverlay 25µm
PI Coverlay 25µm
PI Coverlay 50µm
Solderstop green
onesided TOP
without
onesided TOP
onesided BOT
both sides
Info
Marking print
(legend print)
without
both sides
onesided TOP
onesided BOT
without
white
white
non-standard
yellow
black
E-Test
inclusive
inclusive
Info
Cutouts
Options
3M Tape
without
onesided TOP
onesided BOT
both sides
without
3M 9077 (HT)
3M 9077 (HT)
3M 467MP
3M 9460 (transparent)
Component hole ≤ 0.4mm
No
Yes
No
Info
Impedance control
No
Yes
No
Info
UL marking
without (standard)
without (standard)
in marking print TOP
in marking print BOT
in solderstop TOP
in solderstop BOT
in copper TOP
in copper BOT
Info
Lead-free marking
without (standard)
without (standard)
in marking print TOP
in marking print BOT
in solderstop TOP
in solderstop BOT
in copper TOP
in copper BOT
Info
Production date
without (standard)
without (standard)
in marking print TOP
in marking print BOT
in solderstop TOP
in solderstop BOT
in copper TOP
in copper BOT
IPC Class
2 (standard)
3 (non-standard)
Precision SMD-Stencil
NEW: from €9,90
(eg. 100mm x 120mm)
Info
Stencil for
None
None
TOP
BOT
TOP+BOT (on two Stencils)
Info
Text (Squeegee side)
Info
Surrounding oversize
mm
Info
Size (SMD-Stencil)
X
mm
Info
Thickness
100µm
Standard
100µm
120µm
non-standard
80µm
130µm
150µm
180µm
200µm
250µm
Info
Pad reduction
No
Yes
No
%
Comments
Comments
Comment Customer
Comment
In case of changes or further comments, please contact us before ordering.
Comment Multi
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