SMD solder paste ISO-Cream "Active-Clear" 100g

Universal solder paste, storable at room temperature, suitable for stencil printing

Order

Multi-CB Price: only 21.90 €
Shelf life current batch: 6.9.2021
Delivery time: In stock, immediately available

Scope of delivery

Felder Sn96,5Ag3,0Cu0,5, DIN EN 9453
Flux DIN EN ISO 9454-1: 2016, 1232 (REL1)
Metal content 88,5%, grain size type 4
100g jar

  • Shelf life 12 months at room temperature, no storage in refrigerator necessary.
  • Very good soldering results due to the degree of activation, tolerant towards a moderate print image and towards more strongly oxidized surfaces of PCB and components.
  • Among others, it is ideally suited for stencil printing with reflow process.
  • Simply add to PCB and SMD stencil. Receive everything in one parcel and immediately assemble with fresh solder paste.

The FELDER ISO-Cream® "Active-Clear" differs from the basic version ISO-Cream® "Clear" in the degree of activation. The ISO-Cream® "Active-Clear" has a REL1 flux classification and therefore has a low halogen content (<0.15 %) but is still a genuine NoClean paste. In addition to the properties of the basic version ISO-Cream "Clear", special attention was paid in this further development to an optimized spread, especially on "problematic" surfaces such as chem. Gold (ENIG) or chem. Silver.

ISO-Cream®"Active-Clear" offers the user the possibility to also work with a moderate print image or with more oxidized surfaces of PCB and components and still achieve excellent soldering results. The soldering paste is also low in odor and forms almost colorless flux residues, which spread only to a very limited extent. This is particularly interesting for users who have integrated an automatic optical inspection (AOI) into their process.

In addition, ISO-Cream® "Active-Clear" is also free of any thixotropic agents that could reduce viscosity with increasing shear forces. This guarantees a constant viscosity over a long period of use. In laboratory tests the solder paste showed no bridging, no tendency to tombstoning or solder bead formation on bipolar components.

Composition 96.5% tin, 3% silver, 0.5% copper (SAC305)
Grain size Type 4
Recommended min. edge length of the stencil aperture 200µm
Recommended stencil thickness 100-150µm
Package size 100g
Lead-free Yes, RoHS compliant
No-Clean Yes
Halogen content very low, REL1 < 0,15%
(for halogen free see Loctite)
EN ISO 9454 1.2.3.2
Metal content 88,5%
Shelf life 12 months at room temperatur (up to 20°C)
(for easier storage, see Loctite)
Transport We ship with cooling pack in hot summer and with insulation fleece in freezing winter.
In the critical seasons, UPS Express Saver shipping is highly recommended.
(for easier transport see Loctite)

SMD solder paste Loctite GC10 T4 500g

Storable at 5 - 25°C for 12 months, universal solder paste, suitable for stencil printing

Order

Multi-CB Price: only 85.80 €
Shelf life current batch: 20.08.2021
Delivery time: In stock, immediately available

Scope of delivery

Loctite GC10T4 Sn96,5Ag3,0Cu0,5
Grain size type 4 – for stencil printing
Storable at 5 - 25°C for 12 months
500g jar

  • Temperature stable solderpaste: 12 months storable at 5 - 25°C, or 1 month at 40°C
  • No Clean, Halogen-free und lead-free
  • Among others, it is ideally suited for stencil printing with reflow process.
  • Simply add to PCB and SMD stencil. Receive everything in one parcel and immediately assemble with fresh solder paste.

LOCTITE GC 10, No-clean and Halogen-free Solder Paste, a RoHS-compliant, Excellent resistance in high humidity, Pb-free soldering

LOCTITE® GC 10 is a halogen free, zero halogens added, no-clean, low voiding, Pb-free solder paste specially formulated to provide added long term stability over a wide range of temperature conditions. The enhanced paste stability created through its novel formulation strategy increases both field application yields and on-line paste utilization. LOCTITE GC 10 also shows excellent solderability when reflowed in both air and nitrogen across a wide range of challenging surface finishes and component metallizations including immersion Ag, OSP-Cu, ENIG and CuNiZn. It supports excellent reflow to overcome industry wide HiP and NWO challenges. The new flux chemistry protects the solder joint longer, improves coalescence and optimizes wetting performance, allowing for very shiny solder joints. LOCTITE GC 10 is suitable for use with industry standard SAC alloys.

Shelf life: The manufacturer guarantees 50% on delivery. The European distributor guarantees at least 25%, i.e. 3 months. In addition, the solder paste is stored at Multi-CB. Multi-CB aims to store the solder paste for no longer than 1 month. This results in a guaranteed shelf life of at least 2 months. Usually, however, the solder paste has a much longer remaining shelf life. Shelf life current batch: 20.08.2021

Composition 96.5% tin, 3% silver, 0.5% copper (SAC305)
Grain size Type 4
Recommended min. edge length of the stencil aperture 200µm
Recommended stencil thickness 100-150µm
Package size 500g
(for 100g see Felder)
Lead-free Yes, RoHS compliant
No-Clean Yes
Halogen content No, Halogen-free (ROL0)
Metal content 88,5%
Printing properties Down to 0,3mm pitch
Up to 72 hours stencil life
Up to 24 hours abandon time
Shelf life 12 months at 5 - 25°C (+/- 1,5°C)
1 month at max. 40°C
Transport In freezing winter, we ship with insulation fleece.