SMD solder paste ISO-Cream "Active-Clear" 100g

Universal solder paste, storable at room temperature, suitable for stencil printing

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Multi-CB Price: only 21.89 €
Shelf life current batch: 18.02.2024
Delivery time: In stock, immediately available

Scope of delivery

Felder Sn96,5Ag3,0Cu0,5, DIN EN 9453
Flux DIN EN ISO 9454-1: 2016, 1232 (REL1)
Metal content 88,5%, grain size type 4
100g jar

  • Shelf life 12 months at room temperature, no storage in refrigerator necessary.
  • Very good soldering results due to the degree of activation, tolerant towards a moderate print image and towards more strongly oxidized surfaces of PCB and components.
  • Consistent viscosity over a long application period.
  • Among others, it is ideally suited for stencil printing with reflow process.
  • Simply add to PCB and SMD stencil. Receive everything in one parcel and immediately assemble with fresh solder paste.

The FELDER ISO-Cream® "Active-Clear" differs from the basic version ISO-Cream® "Clear" in the degree of activation. The ISO-Cream® "Active-Clear" has a REL1 flux classification and therefore has a low halogen content (<0.15 %) but is still a genuine NoClean paste. In addition to the properties of the basic version ISO-Cream "Clear", special attention was paid in this further development to an optimized spread, especially on "problematic" surfaces such as chem. Gold (ENIG) or chem. Silver.

ISO-Cream®"Active-Clear" offers the user the possibility to also work with a moderate print image or with more oxidized surfaces of PCB and components and still achieve excellent soldering results. The soldering paste is also low in odor and forms almost colorless flux residues, which spread only to a very limited extent. This is particularly interesting for users who have integrated an automatic optical inspection (AOI) into their process.

In addition, ISO-Cream® "Active-Clear" is also free of any thixotropic agents that could reduce viscosity with increasing shear forces. This guarantees a constant viscosity over a long period of use. In laboratory tests the solder paste showed no bridging, no tendency to tombstoning or solder bead formation on bipolar components.

Composition 96.5% tin, 3% silver, 0.5% copper (SAC305)
Grain size Type 4
Recommended min. edge length of the stencil aperture 200µm
Recommended stencil thickness 100-150µm
Package size 100g
Lead-free Yes, RoHS compliant
No-Clean Yes
Halogen content very low, REL1 < 0,15%
(for halogen free see Loctite)
EN ISO 9454 1.2.3.2
Metal content 88,5%
Shelf life 12 months at room temperatur (up to 20°C)
(for easier storage, see Loctite)
Transport We ship with cooling pack in hot summer and with insulation fleece in freezing winter.
In the critical seasons, UPS Express Saver shipping is highly recommended.
(for easier transport see Loctite)