PCB-Calculator Online

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Optional: automatic analysis of CAD file

Automatic import of important parameters for price calculation (like layers, PCB size etc.). Saves time and avoids mistakes.

	Data format	Accepted	Automatic analysis
	EAGLE (.brd)	✓	✓
	KiCad (.kicad_pcb)	✓	✓
	Target (.T3001)	✓	✓
	Extended Gerber	✓	‐
	ODB++ (.tgz)	✓	‐
	Altium (.pcbdoc)	✓	‐
	Sprint Layout (.lay6)	✓	‐
Info	Other Formats	(✓)	‐

Attach file

Printed Circuit Board

Name

Template name

Your article no.

Layers

pooling available
1 Layer
2 Layers
4 Layers
6 Layers
8 Layers
non-standard
10 Layers
price upon request
12 Layers
14 Layers
16 Layers
18 Layers
20 Layers
22 Layers
24 Layers
26 Layers
28 Layers

please choose
Top
Bot

Only workdays Monday to Friday are counted as working days (= production time). If the order, together with all necessary documents and complete data, is received, and all possible technical questions are clarified by 9 a.m. CET, this day will count as the first working day. The day of despatch of the goods does not count as a working day.

Workdays

For a selection, please first „Calculate“

Estimated dispatch

Format

Single pieces
Panel

Multiplier: same PCB several times in the panel
Mixed multiplier: different PCBs in the panel
more...

Panel Type

Multiplier
Mixed multiplier

If panelization by Multi-CB:
Production starts when we receive approval of the panel data, which are sent to you by email. Panelization by Multi-CB is free of charge.
more...

Panelization

Yes, by Multi-CB
No, panelized data provided

Panel Creation

Yes, panel configurator – without approval of data
Your advantage: No approval of panel necessary, immediate production start
Yes, attach panel drawing
Approval of panel creation necessary
No
Please submit your production data as completed panel

The PCB’s outer contour is milled. more...

Size (x/y)

Quantity

Pieces

Milling:
standard spacing: 2mm
copper / milling edge min. 0.2mm
Scoring:
standard spacing: 0mm
copper / scoring edge min. 0.5mm
jump scoring distance min. 15mm
more...

Mechanical treatment

Milled with perf. Bridges
Milled with bridges
Scored
including jump scoring
Milled and Scored
without mech. treatment

Panel Preview

Milled with perf. bridges

Milled with bridges

Milled without bridges

Scored

Panel size (x/y)

Size (Piece)

PCBs / x-, y-Axis

Pieces

Quantity (Pieces per panel)

Pieces

Three fiducials with solder-stop opening are placed asymmetrically in the border (Ø fiducial 1,5mm; Ø solder-stop opening 3mm).

Border

Without
Above/Below
Left/Right
Surrounding

Milling:
spacing: 2.0mm
copper / milling edge min. 0.2mm
Scoring:
spacing: 0mm
copper / scoring edge min. 0.5mm

Mechanics (x) / Spacing

Milled with perf. bridges
Milled with bridges
Scored
Milled and Scored
Without

Milling:
spacing: 2.0mm
copper / milling edge min. 0.2mm
Scoring:
spacing: 0mm
copper / scoring edge min. 0.5mm

Mechanics (y) / Spacing

Milled with perf. bridges
Milled with bridges
Scored
Milled and Scored
Without

In case your sent data contains soldering paste, we are going to send you the panelized soldering paste with the order confirmation.

Data for soldering paste

X-out: As usual in the industry, PCBs detected by the e-test are marked in the panel. The quantity tolerance is kept.
“Forbid X-Outs in panel” is not necessary for most EMS assembly companies.

No X-Out

Standard
No
non-standard
Forbid X-Outs in panel

In example graphic 4 (A, B, C, D)

Different layouts per panel

Pieces

In example graphic 9 (1xA, 1xB, 6xC, 1xD)

PCBs per panel

Pieces

Quantity

Panel

Pieces

The most common surface finishes are HAL lead-free and chemical gold (ENIG).
more…

Surface finish

Standard
HAL lead-free
Chemical gold (ENIG)
non-standard
Bonding gold (ENEPIG)
galv. Ni/Hartgold
Chemical silver
Chemical tin
HAL SnPb (not RoHS compliant)
Copper blank
Without copper
OSP
Sonderoption

Min. track / space,
annular ring

≥ 900µm
≥ 500µm
≥ 300µm
≥ 250µm
≥ 200µm
≥ 175µm
≥ 150µm
≥ 125µm
≥ 100µm
≥ 90µm
≥ 75µm

μm	mm	mil
500	0.500	20
300	0.300	12
250	0.250	10
175	0.175	7
150	0.150	6
125	0.125	5
100	0.100	4
75	0.075	3

Min. drills

≥ 0.3mm
≥ 0.2mm
non-standard
≥ 0.15mm

Variable (standard):
Multi-CB selects the layer buildup depending on the manufacturing capacity. This is the option most often chosen by our customers (standard).

New: Defined layer buildup for 4 layers (4L-01)

Optimized for impedance applications (e.g. 100 ohm differential).
Impedance control generally only possible with custom layer buildup.

Custom:
Previous option “special layer construction”

more...

Layer buildup

Variable (standard)
Changing stackup according to availability

Variable (standard):
Multi-CB selects the layer buildup depending on the manufacturing capacity. This is the option most often chosen by our customers (standard).

New: Defined layer buildup for 6 layers (6L-01)

Optimized for impedance applications (e.g. 100 ohm differential).
Impedance control generally only possible with custom layer buildup.

Custom:
Previous option “special layer construction”

more...

Layer buildup

Variable (standard)
Changing stackup according to availability

Variable (standard):
Multi-CB selects the layer buildup depending on the manufacturing capacity. This is the option most often chosen by our customers (standard).

New: Defined layer buildup for 8 layers (8L-01)

Optimized for impedance applications (e.g. 100 ohm differential).
Impedance control generally only possible with custom layer buildup.

Custom:
Previous option “special layer construction”

more...

Layer buildup

Variable (standard)
Changing stackup according to availability

For Flex, Rigid-Flex or Metal core (IMS), please switch to the respective calculator. FR4 Tg150 is free of charge for multilayers. more…

Material

FR4
non-standard
FR4 (Tg 150)
FR4 (HTg 170)
Rogers 4350B

0.3mm
0.5mm
0.8mm
1.0mm
1.2mm
1.55mm
2.0mm
2.4mm
3.2mm

Cu outer layers (final) defines the copper thickness of the finished PCB, i.e. after galvanisation, also known as electroplating or electrodeposition.
more…

Cu outer layers (final)

35µm
70µm
105µm
non-standard
140µm
175µm
210µm
245µm
280µm
315µm
350µm
385µm
400µm
455µm
490µm
525µm
560µm

Cu inner layers (final) defines the copper thickness of the finished PCB. There is no galvanisation on inner layers.
more…

Cu inner layers (final)

18µm
35µm
70µm
non-standard
9µm
12µm
105µm
140µm
175µm
210µm
245µm
280µm
315µm
350µm
385µm
400µm
455µm
490µm
525µm
560µm

Solder-stop

both sides
onesided TOP
onesided BOT
without

green
non-standard
black
blue
white
red
yellow

Legend print, also known as marking print or silkscreen.
more...

Legend print
(marking print)

both sides
onesided TOP
onesided BOT
without

white
non-standard
yellow
red
black

E-Test

inclusive

At Multi-CB all kinds of contours and cutouts (inner milling) are without surcharge.
more...

Cutouts

Options

Scoring, also known as V-cutting, is used for mechanical pre-separation of circuit boards.
Only necessary for panels or assembly frames. With 1 PCB in assembly frame, please calculate 1x1 multiplier panel to select scoring.
more...

Scoring

A variable level elevation can be milled at the edge or within a circuit board.
This is called Z-axis milling.
more…

Z-Axis-Milling

both sides
onesided TOP
onesided BOT

Countersink

without
conical
cylindrical
customized option

both sides
onesided TOP
onesided BOT

Gold fingers, also known as connector gold, are manufactured using “hard gold” (electroplated gold), Au thickness 0.8µm - 2µm.
more...

Gold fingers (plug contacts)

Fingers

Chamfering the slot connector makes it easier to insert the PCB into the socket.
more...

Chamfered border

No
Yes (20°)
Yes (30°)
Yes (45°)

Pressfit allows solderless electrical connections. Please send us the data sheet.
more...

Pressfit

Component hole ≤ 0.4mm

Plated-through slots

Plated-through slots, also known as plated slits or plated milling, can be manufactured with a width starting from 0,8mm.
more...

Plated-through slots

inclusive

Sideplating allows partial areas of the PCB edge to be metallized (inside / outside).
more...

Sideplating /
plated half-holes

Buried Vias are used to create connections of the inner layers, which have no contact with the outer layers.
Online pricing is valid for buried vias L2-L3. drill dia. min. 0.2mm
more options on request.
more...

Buried Vias

A Blind Via connects exactly one outer layer with one or more inner layers.
Online pricing is valid for blind vias L1-L2, drill dia. min. 0.2mm
more options on request.
more...

Blind Vias

Several technical or production-related demands require the covering / sealing of vias.
These types of Via covering are possible:

Via Tenting (simple covering)
Via Plugging (partially filled)
Via Filling (completely filled)
more…

Via Filling

without
Plugged Via (III & IV)
Filled Via (V & VI)
Filled and Capped (VII)

Includes impedance calculation and measurement.

You specify impedance type, target value and (if available) the layer buildup. Upload the information together with the layout data in the basket.
If required, you can order the test protocol separately via email. Expense fee €25 (net)

more...

Impedance control

without
Yes, 10% tolerance
Yes, 5% tolerance

Carbon Print

both sides
onesided TOP
onesided BOT
without

An UL marking (fire safety class UL (796) 94/V0) is necessary for the American market. more...

UL marking

without (standard)
in legend print TOP
in legend print BOT
in solderstop TOP
in solderstop BOT
in copper TOP
in copper BOT

The lead-free marking reminds of the RoHS-compliance of our printed circuit boards.
more...

Lead-free marking

without (standard)
in legend print TOP
in legend print BOT
in solderstop TOP
in solderstop BOT
in copper TOP
in copper BOT

Apply production date to the printed circuit board. Will be automatically adjusted for repeat orders.

Production date

without (standard)
in legend print TOP
in legend print BOT
in solderstop TOP
in solderstop BOT
in copper TOP
in copper BOT

IPC Class

2 (standard)
3 (non-standard)

Peelable solder-stop, also known as peelable solder mask, covers holes & pads that require a second soldering process.

Peelable solder-stop

both sides
onesided TOP
onesided BOT
without (standard)

Precision SMD-Stencil From €9,90 (eg. 100mm x 120mm)

All stencils are deburred (brushed) on both sides.
For all further stencil options, please use our stencil calculator.

Stencil for

None
TOP
BOT
TOP+BOT (on two Stencils)

You can create and edit your own stencil templates under "My Account" - "Stencil Templates"
more...
Multi-CB template: Prototype stencil with a surrounding oversize of X mm in relation to the PCB.

Template

Multi-CB

Format

0mm x 0mm = 0dm²

Data positioning

portrait

SMD-Stencil for

none

Thickness

100µm

Text type

half lasered

Archival board

Name (SMD-Stencil)

Your article no.

The text is positioned best possible and is half-lasered on the advantageous squeegee side.
For another text, please use our stencil calculator.

Text (Squeegee side)

Usually the stencil is ordered at least few millimeters larger than PCB size.

Surrounding oversize

For another size or a quick clamping frame, please use our stencil calculator.

Size (SMD-Stencil)

The stencil thickness is chosen according to the component sizes.
The most common stencil thickness is 100µm.
more…

Thickness

Standard
100µm
120µm
non-standard
80µm
130µm
150µm
180µm
200µm
250µm

Padreduction is the reduction of the size of the stencil apertures by Multi-CB.

Pad reduction

Comments

Comment Customer

Comment
In case of changes or further comments, please contact us before ordering.

Comment Multi

Please click on Calculate

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PCB

Optional: automatic analysis of CAD file

Printed Circuit Board

Options

Precision SMD-Stencil From €9,90 (eg. 100mm x 120mm)

Comments

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PCB DISTRIBUTORS WANTED

Possible payment options