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SMD-Stencil
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Metal core
SMD-Stencil Printer
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Optional: automatic analysis of CAD file
Automatic import of important parameters for price calculation (like layers, PCB size etc.)
Data format
Accepted
Automatic analysis
EAGLE (.brd)
✓
✓
KiCad (.kicad_pcb)
✓
✓
Target (.T3001)
✓
✓
Extended Gerber
✓
‐
ODB++ (.tgz)
✓
‐
Altium (.pcbdoc)
✓
‐
Sprint Layout (.lay6)
✓
‐
Other Formats
(✓)
‐
Attach file
Printed Circuit Board
Name
Your article no.
Layers
2 Layers
pooling available
1 Layer
2 Layers
4 Layers
6 Layers
8 Layers
non-standard
10 Layers
price upon request
12 Layers
14 Layers
16 Layers
18 Layers
20 Layers
22 Layers
24 Layers
26 Layers
28 Layers
please choose
Top
Bot
Info
Workdays
For a selection, please first „Calculate“
Estimated dispatch
Format
Single pieces
Single pieces
Panel
Info
Panel Type
Multiplier
Multiplier
Mixed multiplier
Info
Panelization
No, panelized data provided
Yes, by Multi-CB
No, panelized data provided
Panel Creation
No
Yes, panel configurator – without approval of data
Your advantage: No approval of panel necessary, immediate production start
Yes, attach panel drawing
Approval of panel creation necessary
No
Please submit your production data as completed panel
Info
Size (x/y)
X
mm
Quantity
Pieces
Mechanical treatment
please choose
Milled with perf. Bridges
Milled with bridges
Scored
Milled and Scored
without mech. treatment
Panel Preview
Milled with perf. bridges
Milled with bridges
Milled without bridges
Scored
Panel size (x/y)
X
mm
Size (Piece)
X
mm
PCBs / x-, y-Axis
X
Pieces
Quantity (Pieces per panel)
Pieces
Info
Border
Please Choose
Without
Above/Below
Left/Right
Surrounding
mm
Info
Mechanics (x) / Spacing
Please Choose
Milled with perf. bridges
Milled with bridges
Scored
Milled and Scored
Without
mm
Info
Mechanics (y) / Spacing
Please Choose
Milled with perf. bridges
Milled with bridges
Scored
Milled and Scored
Without
mm
Info
Data for soldering paste
Yes
Info
No X-Out
No
No
Forbid X-Outs in panel
Info
Different layouts per panel
Pieces
Info
PCBs per panel
Pieces
Quantity
Panel
Pieces
Info
Surface finish
HAL lead-free
Standard
HAL lead-free
Chemical gold (ENIG)
non-standard
Bonding gold (ENEPIG)
Chemical silver
Chemical tin
HAL SnPb (not RoHS compliant)
Copper blank
Without copper
Min. track / space,
annular ring
≥ 100µm
≥ 500µm
≥ 300µm
≥ 250µm
≥ 200µm
≥ 175µm
≥ 150µm
≥ 125µm
≥ 100µm
≥ 90µm
≥ 75µm
Info
Min. drills
≥ 0.2mm
≥ 0.3mm
≥ 0.2mm
non-standard
≥ 0.15mm
Info
Layer buildup
Variable (standard)
Variable (standard)
Changing stackup according to availability
Info
Material
FR4
FR4
non-standard
FR4 (Tg 150)
FR4 (HTg 170)
Rogers4350B
1.55mm
0.3mm
0.5mm
0.8mm
1.0mm
1.2mm
1.55mm
2.0mm
2.4mm
3.2mm
Info
Cu outer layers (final)
35µm
35µm
70µm
105µm
140µm
210µm
400µm
Info
Cu inner layers (final)
35µm
9µm
12µm
18µm
35µm
70µm
105µm
140µm
210µm
Solder-stop
both sides
both sides
onesided TOP
onesided BOT
without
green
green
non-standard
black
blue
white
red
Info
Marking print
(legend print)
without
both sides
onesided TOP
onesided BOT
without
white
white
non-standard
yellow
red
black
E-Test
inclusive
inclusive
Info
Cutouts
Options
Info
Scoring
No
No
Z-axis milling
mm per panel
Z-axis milling
mm per Piece
Info
Z-axis milling
No
No
Yes
Info
Gold fingers (plug contacts)
No
No
Yes
Gold fingers (plug contacts)
Fingers
Info
Chamfered border
No
No
Yes (20°)
Yes (30°)
Yes (45°)
Info
Pressfit
No
Yes
No
Component hole ≤ 0.4mm
No
Yes
No
Plated-through slits
No
Yes
No
Info
Plated-through slits
inclusive
inclusive
Info
Sideplating /
plated half-holes
No
Yes
No
Info
Buried Vias
No
Yes
No
Info
Blind Vias
No
Yes
No
Via Filling
without
without
Plugged Via (III & IV)
Filled Via (V & VI)
Filled and Capped (VII)
Info
Impedance control
No
Yes
No
Info
UL marking
without (standard)
without (standard)
in marking print TOP
in marking print BOT
in solderstop TOP
in solderstop BOT
in copper TOP
in copper BOT
Info
Lead-free marking
without (standard)
without (standard)
in marking print TOP
in marking print BOT
in solderstop TOP
in solderstop BOT
in copper TOP
in copper BOT
Info
Production date
without (standard)
without (standard)
in marking print TOP
in marking print BOT
in solderstop TOP
in solderstop BOT
in copper TOP
in copper BOT
IPC Class
2 (standard)
2 (standard)
3 (non-standard)
Info
Peelable solder-stop
without (standard)
both sides
onesided TOP
onesided BOT
without (standard)
Precision SMD-Stencil
NEW: from €9,90
(eg. 100mm x 120mm)
Info
Stencil for
None
None
TOP
BOT
TOP+BOT (on two Stencils)
Info
Text (Squeegee side)
Info
Surrounding oversize
mm
Info
Size (SMD-Stencil)
X
mm
Info
Thickness
100µm
Standard
100µm
120µm
non-standard
80µm
130µm
150µm
180µm
200µm
250µm
Info
Pad reduction
No
Yes
No
%
Comments
Comments
Comment Customer
Comment
In case of changes or further comments, please contact us before ordering.
Comment Multi
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