Felder Sn96,5Ag3,0Cu0,5, DIN EN 9453
Flux DIN EN ISO 9454-1: 2016, 1232 (REL1)
Metal content 88,5%, grain size type 4
100g jar
The FELDER ISO-Cream® "Active-Clear" differs from the basic version ISO-Cream® "Clear" in the degree of activation. The ISO-Cream® "Active-Clear" has a REL1 flux classification and therefore has a low halogen content (<0.15 %) but is still a genuine NoClean paste. In addition to the properties of the basic version ISO-Cream "Clear", special attention was paid in this further development to an optimized spread, especially on "problematic" surfaces such as chem. Gold (ENIG) or chem. Silver.
ISO-Cream®"Active-Clear" offers the user the possibility to also work with a moderate print image or with more oxidized surfaces of PCB and components and still achieve excellent soldering results. The soldering paste is also low in odor and forms almost colorless flux residues, which spread only to a very limited extent. This is particularly interesting for users who have integrated an automatic optical inspection (AOI) into their process.
In addition, ISO-Cream® "Active-Clear" is also free of any thixotropic agents that could reduce viscosity with increasing shear forces. This guarantees a constant viscosity over a long period of use. In laboratory tests the solder paste showed no bridging, no tendency to tombstoning or solder bead formation on bipolar components.
| Composition | 96.5% tin, 3% silver, 0.5% copper (SAC305) |
| Grain size | Type 4 Recommended min. edge length of the stencil aperture 200µm Recommended stencil thickness 100-150µm |
| Package size | 100g |
| Lead-free | Yes, RoHS compliant |
| No-Clean | Yes |
| Halogen content | very low, REL1 < 0,15% (for halogen free see Loctite) |
| EN ISO 9454 | 1.2.3.2 |
| Metal content | 88,5% |
| Shelf life | 12 months at room temperatur (up to 20°C) (for easier storage, see Loctite) |
| Transport | We ship with cooling pack in hot summer and with insulation fleece in freezing winter. In the critical seasons, UPS Express Saver shipping is highly recommended. (for easier transport see Loctite) |
Ever finer structures and smaller components place great demands on solder paste printing. After intensive market research, Multi-CB offers the following high-precision SMD-Stencil printers for prototypes as well as small and medium series.
All devices print precise and reproducible, even the finest structures. Our focus is on high quality standards and an optimal cost / benefit ratio.
| khs-instruments SMT-PCB-A4 | PAGGEN TSD240 | FRITSCH printALL005 | |
|---|---|---|---|
| One-sided SMD | |||
| Double-sided SMD | |||
| max. component height | 8 mm | 11 mm | 18 mm |
| PCB size max.* | 105mm x 180mm | 180mm x 240mm | 270mm x 330mm |
| SMD-Stencil size max. | 200mm x 200mm | 175mm x 255mm | 280mm x 360mm |
| Smallest structure | 0.5 mm | 0.5 mm | 0.5 mm |
| Parallel lift (vertical separation) | |||
| Unrolling the stencil | |||
| Z-height adjustable | 1mm or 1,6mm | ||
| X-axis alignment | Manually | ||
| Y-axis alignment | Manually | ||
| Theta-axis alignment | Manually | ||
| Stand area | 170mm x 280mm | 240mm x 370mm | 360mm x 545mm |
| Weight | 1.6 kg | 7 kg | 15 kg + 2 kg (clamping frame) |
| Price | 230.00 € | 1093.00 € | 1998.00 € |
The khs-instruments SMT-PCB-A4 is an ingeniously simple manual stencil printer. The stencil printer is the result of decades of experience in assembling small series and numerous improvement steps. It has existed in its current version since 2017.
| SMD-Stencil size max. | 200mm x 200mm |
| SMD-Stencil size min.* | ca. 40mm x 40mm |
| PCB size max. | 105mm x 180mm |
| PCB size min. | 7mm x 5mm |
| PCB thicknesses | 1,55mm or 1mm |
| Doublesided PCB | yes; max. height 8mm |
| Dimensions (LxWxH) | 170mm x 280mm x 45mm |
| Weight | 1,6kg |
*KHS recommends a 15mm circumferentially larger stencil compared to the PCB size.
The PAGGEN TSD240 stencil printer is suitable for high-precision manual application of solder paste or adhesive on printed circuit boards. The outstanding design for this price range makes manual assembly much easier.
| SMD-Stencil size max. | 175mm x 255mm |
| SMD-Stencil size min. | ca. 40mm x 40mm |
| PCB size max.* | 180mm x 240mm |
| Height setting | 25mm |
| Dimensions (WxLxH) | 265mm x 430mm x 100mm |
| Stand area | 360mm x 545mm |
| Weight | 7kg |
*The max. printing area is peripherically approx. 10mm smaller.
The FRITSCH printALL005 is a manual stencil printing system with a sturdy base frame for a very high print quality, suitable for applying solder paste or adhesive to printed circuit boards. The solid construction offers a clean and reproducible print with easy handling, even for small components with fine structures up to 0.5 mm.
The X-Y and Theta-axis can be set quickly and easily by using knurled screws. A parallel lift ensures a clean separation of PCB and SMD-Stencil, which guarantees an improved release of the solder paste. It is ideally suited for the production of prototypes and small series.
Already included is the universal clamping frame (903.204), which fits a wide variety of stencil dimensions. The clamping is done from two sides, there are no stencil mounting holes necessary.
Plus 23,90 net packaging costs for the safe shipping of 17 kg high-tech equipment
| SMD-Stencil size max. | 280mm x 360mm |
| SMD-Stencil size min. | ca. 50mm x 50mm |
| PCB size max.* | 270mm x 330mm |
| Adjusting range X/Y | ± 7.5mm |
| Adjusting range Theta | ± 3° |
| Dimensions (WxLxH) | 400mm x 650mm x 150mm, closed |
| Stand area | 360mm x 545mm |
| Weight | 15kg + 2 kg (clamping frame) |
*The max. printing area is peripherically approx. 10mm smaller.
